| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure a determination on whether or not any fine dust is existent as adhering to a wafer back surface serving as a factor of defocusing, because foreign matter, if it is existent between a stage of an exposing apparatus and a semiconductor wafer, might cause a semiconductor wafer surface to bulge and hence cause local defocusing and further cause bad patterning of a resist. <P>SOLUTION: In a general semiconductor exposing apparatus, there is provided a part for storing a parameter result upon exposure for every shot. From such a constitution, there is provided algorithm where values that control focusing and leveling for every shot are compared and judged in a wafer surface and in a data base. This enables any fine dust adhering to the wafer back surface to be detected. It is thus possible to provide a semiconductor exposing apparatus with high productivity and high reliability, and to provide a semiconductor manufacturing method using the same apparatus. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
