| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of voids at a joined layer between an electronic component and a printed circuit board for the electronic component, in a mounting structure for the electronic component. SOLUTION: The mounting structure 1 for the electronic component is formed by mounting the electronic component 10 on the printed circuit board 6 for the electronic component, and by joining a junction pattern 4 to the printed circuit board 6 for the electronic component through the joined layer 5 formed by a cream solder, in which the electronic component includes an LED chip 2, a device mounting substrate 3 on which the LED chip 2 is mounted, and the junction pattern 4 formed on a rear face 31 of the device mounting substrate 3. The mounting structure includes a vent path 7 to accelerate discharge of vaporized organic components in the cream solder, at an inside region of an outer periphery 40 of the junction pattern of the joined layer 5. The vaporized organic components are easily discharged outside the joined layer 5 through the vent path 7 to prevent generation of the voids at the joined layer 5. COPYRIGHT: (C)2006,JPO&NCIPI
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