| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a matter that a self-scanning light emitting element array substrate requires further improvement incident to reduction in size and enhancement of resolution but reduction in size becomes difficult as the number of interconnect lines increases, and to solve a matter that significant manhours and facility cost are required in fabrication because of such a problem and the cost of a light emitting element head is increased. <P>SOLUTION: When the number of light emitting element arrays being arranged on a self-scanning light emitting element array substrate and the number of signals being wired to an auxiliary drive IC are decreased, the number of interconnect lines of a light emitting element head can be decreased. Consequently, space saving can be realized on the substrate and an inexpensive SLED can be provided by simplifying the fabrication process. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
