| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing composition which is used for manufacturing a semiconductor device and can polish the surface of copper without damaging it and planarize it in the formation of a copper interconnection. <P>SOLUTION: The polishing composition consists of a copolymer resin which is soluble in water at a density of 5-200 g/100 ml at 25°C, a water soluble compound which can form a complex with metal, an oxidant, and water. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
