| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate sealing device and its method for easily and accurately setting a gap between two substrates and increasing precision of parallelism for improvement in quality. SOLUTION: This substrate sealing device arranging a front substrate 2 and a back substrate 4 face to face in parallel at a proper gap and sealing them mutually via a sealant (indium) is provided with an electrostatic chuck 21 fixing and holding the front substrate, a pressurizing mechanism 24 supporting the back substrate and pressing and pressurizing it to the front substrate, and a gap setting mechanism 26 arranged between the pressurizing mechanism and the back substrate for restricting further pressurization when a gap between the front substrate and the back substrate reaches a proper value with respect to the electrostatic chuck or the front substrate as a reference face while indium thickness is continuously reduced because of pressurization by the pressure mechanism and heating fusion. COPYRIGHT: (C)2006,JPO&NCIPI
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