发明名称 ADHESIVE FOR FIXING FOLD OF FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide an adhesive for fixing fold of a flexible printed circuit board (FPC), having heat resistance, excellent repulsion resistance of the FPC and processing suitability; and to provide the flexible printed circuit board, electronic equipment and a double sided adhesive sheet. SOLUTION: The adhesive usable for fixing the flexible printed board by folding the board has (a) 800-1,400% breaking elongation E at tensile break of the adhesive, and 300-700 kPa breaking strength T, and (b) 210-700 kPa breaking strength T<SB>60°C</SB>at tensile break of the adhesive after being left at 60°C for 100 hr. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006089564(A) 申请公布日期 2006.04.06
申请号 JP20040275365 申请日期 2004.09.22
申请人 DAINIPPON INK & CHEM INC 发明人 IWASAKI TAKESHI;TANABE HIROSUKE
分类号 C09J201/00;C09J7/02;C09J133/06;H05K1/03 主分类号 C09J201/00
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