发明名称 |
METHOD AND SYSTEM FOR HIGH VOLUME TRANSFER OF DIES TO SUBSTRATES |
摘要 |
A method, system, and apparatus for transfer of dies using a die plate is described herein. The die plate has a planar body. The body has a plurality of holes therethrough. A support structure and the die plate can be positioned to be closely adjacent to each other such that each die of a plurality of dies attached to the support structure adheres to a first surface of the die plate. The dies can subsequently be transferred from the die plate to one or more destination substrates or other surfaces, by a punching mechanism. |
申请公布号 |
EP1642325(A2) |
申请公布日期 |
2006.04.05 |
申请号 |
EP20040754983 |
申请日期 |
2004.06.14 |
申请人 |
SYMBOL TECHNOLOGIES, INC. |
发明人 |
ARNESON, MICHAEL R.;BANDY, WILLIAM R. |
分类号 |
B23P19/00;B29C65/00;G06K19/077;G08B13/14;H01L21/00;H01L21/44;H01L21/60;H01L21/68;H01L21/78;H01L29/06;H01R43/00;H04Q5/22;H05K3/00;H05K3/30;H05K3/34;H05K3/36 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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