发明名称 |
MODULE INCLUDING CIRCUIT ELEMENTS |
摘要 |
In a module (51) including circuit elements, a plurality of wires (12), which are generally two-dimensionally formed, are multi-layered via electrically insulating material (11), which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module (51) further includes a heat sink member (13) that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element (14), which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.
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申请公布号 |
EP1643552(A1) |
申请公布日期 |
2006.04.05 |
申请号 |
EP20040731753 |
申请日期 |
2004.05.07 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HANDA, HIROYUKI;NAKATANI, SEIICHI;HIRANO, KOICHI;INOUE, OSAMU;ISHIKAWA, AKIHIRO;YOSHIDA, TSUNENORI |
分类号 |
H01L23/538;H01L25/16;H05K1/02;H05K1/18;H05K3/46;(IPC1-7):H01L25/00 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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