| 摘要 |
A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of outer leads. The package further comprises at least three chips, each having a surface comprising a plurality of pads. The chips are disposed with the surfaces comprising the pads face to face. A plurality of bumps are disposed on some of the pads to electrically connect the chips. A plurality of electrical conductors connects predetermined ones of the pads to the inner leads; and an insulation material fully or partially seals the die pad, the chips and the inner leads. |
