发明名称 Method and system for vertical optical coupling on semiconductor substrate
摘要 <p>Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.</p>
申请公布号 EP1643280(A1) 申请公布日期 2006.04.05
申请号 EP20050255984 申请日期 2005.09.26
申请人 STMICROELECTRONICS, INC. 发明人 FANG, MING;TULLOS, LARRY R.;DING, HAI
分类号 G02B6/42 主分类号 G02B6/42
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