Semiconductor device with different bonding configurations

摘要

Two different switches with two different signal input schemes are fabricated by mounting the same semiconductor chip on the same lead pattern (2). Two of the leads (2a,2c) of the lead pattern (2) provide enough space for wire-bonding connections (4) to corresponding electrode pads (C1,C2) on the semiconductor chip (3) at both ends of the semiconductor chip (3). Because each of electrode pads (C1,C2) can be connected to the corresponding lead (2a,2c) at either end of the semiconductor chip (3), two sets of bonding wire connections (4) between the leads (2a,2c) and the electrode pads (C1,C2) provide two different switches with two different signal inputs scheme.