| 摘要 |
A method of forming a shallow trench isolation device in order to prevent kick effects comprising a semiconductor structure having a patterned masking layer formed thereon. A shallow trench is formed in the semiconductor structure by using the patterned masking layer as a mask. A liner oxide layer and a doped dielectric layer are formed in sequence on the semiconductor structure to cover the surface of the shallow trench. A layer of oxide is formed on the semiconductor structure to fill the shallow trench. The dopants in the doped dielectric layer diffuse into the semiconductor structure surrounding the shallow trench to form an ion doped area, thereby increasing the threshold voltage caused by the recess on the corner structure in order to prevent the kick effect.
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