发明名称 Heat dissipating device with uniform heat points
摘要 A heat dissipating device with uniform heat points, having a first heat sink, a second heat sink and at least two heat pipes. The second heat sink is aligned over the first heat sink. Each heat pipe has a heat absorbing portion and a heat dissipating portion. The heat absorbing and dissipating portions of each heat pipe are in thermal communication with the first and second heat sinks, respectively. The distance between two neighboring heat absorbing portions is smaller than the distance between the heat pipe and the heat sink. Thereby, the heat absorbing portions are concentrated to absorb heat generated by a heat source, and the heat dissipating portions are distributed over a larger area to effectively dissipate the heat.
申请公布号 US7021368(B2) 申请公布日期 2006.04.04
申请号 US20030704571 申请日期 2003.11.12
申请人 CPUMATE INC. 发明人 LIN KUO-LEN;TSUI HUI-MIN
分类号 H05K7/20;F28D15/00;H01L23/427 主分类号 H05K7/20
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