发明名称 Package module
摘要 A package module includes a module case and an adapter case attached to the module case. The module case accommodates a circuit board, and the adapter is used for connecting an external connector. An opening at an end of the adapter case functions as an entry to receive the external connector. Another opening at the other end functions as a connection hole to be attached to the module case. A fit-receiving portion is mounted on the upper wall adjacent to the connection hole of the adapter case in such a way that a fit-receiving opening faces down. When the module case is moved upward relative to the adapter case, a fit projection is fit into a fit-receiving portion to connect the module case and the adapter case.
申请公布号 US7021834(B2) 申请公布日期 2006.04.04
申请号 US20040506027 申请日期 2004.08.26
申请人 MURATA MANUFACTURING CO., LTD. 发明人 OHTERA SHOZO
分类号 G02B6/36;G02B6/38;G02B6/42 主分类号 G02B6/36
代理机构 代理人
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