发明名称 |
Method for fabricating circuit module |
摘要 |
A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.
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申请公布号 |
US7022554(B2) |
申请公布日期 |
2006.04.04 |
申请号 |
US20030705823 |
申请日期 |
2003.11.13 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KASUE KAZUO;KAJIKAWA TAKEHISA;HACHINOHE SATORU |
分类号 |
H01L21/44;H05K3/28;H01L21/48;H01L21/50;H01L21/56 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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