发明名称 Method and apparatus for cooling heat generating components
摘要 A device and a system for cooling heat generating electronics is disclosed. In one embodiment, the invention is a system for cooling at least one computer component. The system has a plurality of cold plates which are adapted to transfer heat from a plurality of computer components to a cooling fluid. A supply line supplies the cooling fluid to and from these cold plates. The system also has a housing with one or more racks to support the computer component(s). The racks may also support the cold plates so that the cold plates are in thermal communication with at least one computer component.
申请公布号 US7024573(B2) 申请公布日期 2006.04.04
申请号 US20020062443 申请日期 2002.02.05
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 PATEL CHANDRAKANT D.;BASH CULLEN E.
分类号 G06F1/26;F25B25/00;F28F9/26;G06F1/20;H05K7/20 主分类号 G06F1/26
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