SUBSTRATE HOLDING STRUCTURE AND SUBSTRATE PROCESSING DEVICE

摘要

An object of the invention is to suppress thermal stress breakage of a substrate holding platform in a substrate holding structure for holding a processing subject substrate. In a board holding structure provided with a board holding platform at the front end of a pillar, a joining section between the pillar and the substrate holding platform is formed with a flange defined by the inner and outer peripheral surfaces, in which case the inner peripheral surface is formed of an inclined surface in which the inner diameter of the flange continuously increases toward the lower surface of the substrate holding platform. Further, the lower surface of the substrate holding platform to which the flange is joined is formed with a U-shaped groove corresponding to the outer peripheral surface of the flange.