| 摘要 |
A SEMICONDUCTOR DEVICE PACKAGE (53) HAVING A LEAD FRAME WITH A MOUNTING PAD (31) SMALLER THAN THE IC CHIP (10) MOUNTED THEREON, AND A METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE BASED ON WIRE BONDING USING A HEATER INSERT (38) WITH A MOUNTING PAD INSERTION CONCAVE PART (51). SEPARATION BETWEEN THE MOUNTING PAD AND AN ENCAPSULATING RESIN IS ELIMINATED, CRACKS ARE NOT CREATED IN THE RESIN, OR ARE CONDISIDERABLY REDUCED, AND WARPAGE OF THE PACKAGE CAN BE PREVENTED. ALSO, BONDING OF WIRES BETWEEN LEADS AND RESPECTIVE BONDING PADS (17) ON THE CHIP (10) CAN BE EXECUTED STABLY AND EFFICIENTLY. (FIG. 1) |
