SEMICONDUCTOR DEVICE MANUFACTURING METHOD.

摘要

SEMICONDUCTOR DEVICE CHIPS MANUFACTURING AND INSPECTING METHOD IS DISCLOSED IN WHICH A SEMICONDUCTOR WAFER (1A) IS CUT INTO INDIVIDUAL LSI CHIPS (1B). THE LSI CHIPS (1B) ARE REARRANGED AND INTEGRATED INTO A PREDETERMINED NUMBER. THE CUT LSI CHIPS (1B) ARE INTEGRATED IN A JIG HAVING OPENINGS WITH A SIZE COMMENSURATE WITH THE DIMENSIONS OF THE LSI CHIP. AT LEAST ONE PART OF THE JIG HAVING SUCH OPENINGS HAS A COEFFICIENT OF THERMAL EXPANSION THAT IS APPROXIMATELY EQUAL TO THAT OF THE LSI CHIPS (1B). THE INTEGRATED PREDETERMINED NUMBER OF CHIPS ARE SUBJECTED TO AN INSPECTION PROCESS IN A SUBSEQUENT INSPECTION STEP THEREBY IMPROVING EFFICIENCY AND REDUCING COST.(FIG. 3)