发明名称 REMOTE PLASMA ACTIVATED NITRIDATION
摘要 PROBLEM TO BE SOLVED: To provide an improving method for incorporating nitrogen for forming a nitrogen-contained material. SOLUTION: A semiconductor working method comprises a step for providing a single substrate reaction chamber which is gas-communicated with a supply source of NH<SB>3</SB>and gas-communicated with an excited species generator, a step for providing a semiconductor substrate in the reaction chamber, a step for generating excited species in the excited species generator, a step for exposing the NH<SB>3</SB>to the excited species at upstream of the substrate and downstream of the excited species generator, and a step for exposing the substrate to the NH<SB>3</SB>and the excited species after exposing the NH<SB>3</SB>to the excited species. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006086521(A) 申请公布日期 2006.03.30
申请号 JP20050245398 申请日期 2005.08.26
申请人 ASM AMERICA INC 发明人 JOHAN SWART;HILDE DE WITTE;MAES JAN WILLEM;POMAREDE CHRISTOPHE;HAVERKORT RUBEN;WAN YUET MEI;DE BLANK MARINUS J;VAN DER JEUGD CORNELIUS A;BEULENS JACOBUS JOHANNES
分类号 H01L21/318;C23C16/34;H01L29/78 主分类号 H01L21/318
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