| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component with bump electrode, which has an insulating film for surface protection in sufficient film thickness and a bump part in sufficient height and in which occurrence of an open fault is appropriately reduced in a manufacture process. SOLUTION: The electronic component X1 is provided with a substrate 11, an electrode pad 12 arranged on the substrate 11, the insulating film 13 which has an opening part 13a corresponding to the electrode pad 12 and is laminated and formed on the substrate 11, a conductive connection part 14 disposed on the electrode pad 12 in the opening part 13a and the bump part 15 having a spherical part which is directly brought into contact with the conductive connection part 14 and is projected from the opening part 13a. A diameter of the spherical part of the bump part 15 is larger than that of the opening part of the insulating film 13. COPYRIGHT: (C)2006,JPO&NCIPI
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