发明名称 ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroplating device capable of uniformly dispersing or dissolving additives to a plating liquid, and to provide an electroplating method using the same. SOLUTION: The electroplating device is equipped with: an electroplating tank 11 of performing electroplating treatment to the face to be treated of a substrate W in a state of being filled with a plating liquid; a plating liquid feed tube 22 of feeding a plating liquid M to the electroplating tank 11; an electrolytic solution feed part 23 connected to the plating liquid feed tube 22 and feeding an electrolytic solution so as to be the main component of the plating liquid M to the plating liquid feed tube 22; and an additive feed part 24 connected to a position between the electroplating tank 11 and the electrolytic solution feed part 23 in the plating liquid feed tube 22 and feeding additives to the plating liquid feed tube 22. In the plating liquid feed tube 22, a mixing mechanism 31 of mixing the electrolytic solution E and the additives A, B and C and preparing the plating liquid M is provided at a position connected with the additive feed part 24 or at the side closer to the electroplating tank 11 from the above position. The electroplating method uses the same. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006083445(A) 申请公布日期 2006.03.30
申请号 JP20040271045 申请日期 2004.09.17
申请人 SONY CORP 发明人 KATO YOSHINORI
分类号 C25D21/14;C25D5/08;C25D7/12;H01L21/288;H01L21/3205 主分类号 C25D21/14
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