发明名称 DIMPLE FORMING METHOD AND DIMPLE FORMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a dimple forming method which dispenses with pre-treatment and after-treatment, dispenses with a high energy source, and is implemented with high efficiency and high accuracy by a very simple device structure, and to provide a dimple forming device. <P>SOLUTION: According to the dimple forming method, an oscillator 5 is arranged near a surface of a workpiece 7 which is formed of a metallic or a nonmetallic material, via a liquid 9, and the oscillator 5 is subjected to high frequency oscillation, to thereby generate fine cavitation bubbles in the liquid. By virtue of an action of shock waves generated at the time of collapse of the cavitation bubbles, a large number of dimples are formed in the surface of the workpiece due to plastic deformation. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006082163(A) 申请公布日期 2006.03.30
申请号 JP20040267766 申请日期 2004.09.15
申请人 TOSHIBA PLANT SYSTEMS & SERVICES CORP 发明人 OGAWARA TAKASHI;OZONO JIRO
分类号 B23P17/00;F16C9/04;F16C33/10;F16C33/14 主分类号 B23P17/00
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