| 摘要 |
PROBLEM TO BE SOLVED: To enable uniform treatment in the surface of a semiconductor substrate by devising supply of treatment liquid. SOLUTION: The flow rate of a flow rate adjusting valve is made larger gradually than the flow rate by a pump until a liquid level reaches a lower limit position LL, and the flow rate of the flow rate adjusting valve is made smaller gradually than the flow rate of the pump until the liquid level attains to an upper limit position. The liquid level of the treatment liquid stored in an inner vessel 3 is moved up and down by adjusting each part in this way. Since the liquid level moves up and down along the surface of a semiconductor substrate W, in-plane uniformity of the semiconductor substrate W is further improved in treatment. COPYRIGHT: (C)2006,JPO&NCIPI
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