| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film which exhibits a high modulus and is excellent in flexibility, low moisture expansion coefficient, thermal dimensional stability and film formability, when employed for a substrate for metal wiring boards for flexible printed circuits on the surface of which metal wiring is provided, CSP's, COF's, BGA's or tape automated bonding tapes (TAB tapes), its manufacturing process and a metal wiring board using it as a substrate. SOLUTION: The polyimide film is produced from a polyamic acid obtained from a composition consisting of at least naphthalenetetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride and 1,3-bis(4-aminophenoxy)benzene and has a Young's modulus of 4-10 [GPa]. COPYRIGHT: (C)2006,JPO&NCIPI |
