| 摘要 |
PROBLEM TO BE SOLVED: To avoid that the moisture resistance over the element falls by bending lead terminals 3 and 4 so that the part of the element 2, such as a semiconductor chip, etc. may move to the bottom of the package body in an electronic part which seals and changes so that the lead terminals 3 and 4 electrically connected with the element may project from the side face of the package body in the package body 5 made of a synthetic resin. SOLUTION: A synthetic resin 6 is applied so that both the front surfaces of the lead terminals 3 and 4 and the front surface of the package body 5 may be bridged over the part of the root part as opposed to the package body 5 among the lead terminals 3 and 4. COPYRIGHT: (C)2006,JPO&NCIPI
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