| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate material facilitating recycling of punching loss and capable of being easily pasted on a target position in a work site and an efficient manufacturing process for this substrate material. SOLUTION: The substrate material 10 used when putty is applied to a building comprises a thin plate 11 with a plurality of holes 11b opened on its surface, adhesive 12 attached at least on part of one face of the plate 11 other than the holes 11b and a release sheet 13. The substrate material 10 can be manufactured by a method including the process of boring holes 11b on the thin plate 11, the process of attaching the adhesive 12 at least on part of one face of the thin plate 11 other than the holes 11b and the process of arranging a release sheet 13 over the adhesive 12 attached. COPYRIGHT: (C)2006,JPO&NCIPI
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