发明名称 |
Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same |
摘要 |
A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of such as gold on an upper surface or a part of the upper surface and side surface. A wet prevention film of such as an oxide film is formed on the columnar bump side as needed. If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface. Stabilized and reliable junction form can be thus formed. Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.
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申请公布号 |
US2006065978(A1) |
申请公布日期 |
2006.03.30 |
申请号 |
US20050271819 |
申请日期 |
2005.11.14 |
申请人 |
NEC CORPORATION |
发明人 |
NISHIYAMA TOMOHIRO;TAGO MASAMOTO |
分类号 |
C25D7/12;H01L21/44;H01L21/56;H01L21/60;H01L23/48;H01L23/485 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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