| 摘要 |
The invention provides a film carrier tape for mounting electronic devices thereon and a flexible substrate, which prevent generation of static electricity, thereby enhancing reliability and productivity of a semiconductor chip mounting line. The film carrier tape for mounting electronic devices thereon including a continuous insulating layer; a wiring pattern formed through patterning of a conductor layer and provided on at least a top surface of the insulating layer; a row of sprocket holes provided along each longitudinal edge of the wiring pattern; an electricity-conducting layer provided on the top surface of the insulating layer continuously in the longitudinal direction of the insulating layer; and an antistatic layer formed of an antistatic agent which is provided at least on each longitudinal edge or in an area in the vicinity of each edge of a bottom surface of the insulating layer in the longitudinal direction of the insulating layer, wherein the electricity-conducting layer or the conductor layer electrically connected with the electricity-conducting layer is electrically connected with the antistatic layer through a longitudinal side surface of the tape or through inner peripheral surfaces of the sprocket holes.
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