| 摘要 |
A semiconductor device includes a substrate for transmitting light, a wiring layer provided on the substrate, a semiconductor chip formed on the wiring layer, a columnar electrode, a sealant, and an external connection terminal electrically connected to the semiconductor chip via the wiring layer and protruding electrode. The device includes a cut surface formed by dicing and constituted by only the substrate and the sealant. Since the cut surface has a single-layer structure as a result of forming the sealant in a single step, moisture cannot infiltrate through the sealant, hence a device resistant to corrosion and operational defects is provided.
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