发明名称 |
Mobile electrostatic substrate holder used in making thin electronic chips, includes ring seal and nearby drainage channels to remove any fluid ingress to drain |
摘要 |
<p>A ring seal (13) incorporated at the edge is located close to drainage passages (12). Fluid (11) ingress at the inner edge of the ring seal (13) is led away by the passages (12) and drained away outside the substrate holder. Drainage from the region between wafer (2) and substrate holder is further enhanced by reduction of pressure, connecting to a vacuum vessel or ejector.</p> |
申请公布号 |
DE102004045447(A1) |
申请公布日期 |
2006.03.30 |
申请号 |
DE20041045447 |
申请日期 |
2004.09.18 |
申请人 |
VENTEC GESELLSCHAFT FUER VENTUREKAPITAL UND UNTERNEHMENSBERATUNG MBH |
发明人 |
HINN, MICHAEL;RETZLAFF, UDO;KEILBACH, STEFFEN |
分类号 |
H01L21/67;H01L21/66 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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