发明名称 SUBMOUNT INCLUDING TRANSISTOR FOR LIGHT EMITTING DEVICE WITH FLIPCHIP STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a submount including a transistor, which is used for mounting a light emitting element in a light emitting device with a flipchip structure. <P>SOLUTION: A submount, which is used for mounting a nitride semiconductor light emitting element in a light emitting device with a flipchip structure, comprises: a substrate made of a semiconductor material of a first conductivity type; a first region which is made of a semiconductor material of a second conductivity type and is formed on a partial area of the substrate; a second region which is made of the semiconductor material of the second conductivity type and is formed on an area other than the first region; first and second electrodes which are formed on the first and second regions respectively; and a conductive layer formed on the back of the substrate. The first and second electrodes are connected to an n-side electrode and a p-side electrode of the nitride semiconductor light emitting element through bumps. According to this invention, a high-voltage current caused by static electricity or the like is prevented from flowing into the nitride semiconductor light emitting element in the light emitting device with the flipchip structure for avoiding breakdown of the element and for enhancing the reliability of the element. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006086485(A) 申请公布日期 2006.03.30
申请号 JP20040358251 申请日期 2004.12.10
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 KIM HYUN KYUNG;LEE HYUK MIN;SHIN HYUN-SOO;PYEON IN JOON
分类号 H01L21/331;H01L25/16;H01L29/73;H01L33/32;H01L33/62 主分类号 H01L21/331
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