| 摘要 |
A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.
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