| 摘要 |
PROBLEM TO BE SOLVED: To suppress extension of a semiconductor integrated circuit chip generated in the laminating direction of its layers, even if integrated circuits, are laminated, in order to realize a plurality of functions. SOLUTION: A through hole 18 is so formed in the special portions 20 of a plurality of layers as to connect the end terminal 14T of a connecting wire 14 at the integrated circuit 12L2 of a layer L2 with the end terminal 14T of a connecting wire 14 at the integrated circuit 12Ln of a layer Ln. Epoxy resin is filled into the through hole 18. In this way, since the end terminal 14T of the connecting wire 14 at the integrated circuit 12L2 of the layer L2 and the end terminal 14T of the connecting wire 14 at the integrated circuit 12Ln of the layer Ln are connected, respectively with the through hole 18 filled with the conductive epoxy resin, the respective end terminals 14T are connected with each other. COPYRIGHT: (C)2006,JPO&NCIPI
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