| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for surface treatment for efficiently forming a high solder wettability region, in which solder wettability is high and a low solder wettability area in which solder wettability is low or solder does not become wet, and to provide a manufacturing method of an electronic component. SOLUTION: In the case of forming a terminal 3 of a mount boarding 1, a gold-plated layer 13 is formed on the surface of a nickel-plated layer 12, and a prescribed area is irradiated with laser beams. As a result, in the area irradiated with the laser beams, a part of the gold-plated layer 13 is removed, and gold and nickel spread from each other to form a low solder wettability region 320 composed of a mixed layer 15 of nickel and gold. In a region which is not irradiated with the laser beams, high solder wettability areas 310, 330 where the gold plating layer 13 remains as it is are formed. When irradiating laser beams like this, an air stream is generated on the surface of the mount board 1 to prevent the re-sticking of melted and evaporated foreign matters. COPYRIGHT: (C)2006,JPO&NCIPI
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