| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package which inhibits a decline in light-emitting efficiency, selecting and using a highly heat conductive material which makes heat dissipation property higher, in order to cope with heat generation from the LED chip of an LED light emitting device. <P>SOLUTION: In the package for the light emitting device including a frame metal base 11, the LED chip 12, and an insulating member 14 which leads out a lead member 13 connected to the LED chip 12; the LED package 10 is constituted by mounting the LED chip 12 at a predetermined position in the frame of the metal base 11, in such a state as the chip is directly put into contact with the highly heat conductive carbon material 16 of a metal impregnated carbon material (MICC). When the metal base 11 comprises a mortar shape side wall member 18 and a bottom plate member 19, the insulating member 14 forms an opening 15 and a conductive pattern is provided for leading outside. The LED chip is mounted on the highly heat conductive carbon material arranged at the opening, and is connected with a lead through a wire bonding 17 and the conductive pattern for leading outside. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
