SEMICONDUCTOR WAFER POLISHING DEVICE AND METHOD FOR POLISHING USING SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer polishing device that is constituted to effectively prevent a semiconductor wafer from being contaminated with a heavy metal in a mirror polishing step, and to provide a method for polishing using the device.

SOLUTION: The semiconductor wafer polishing device which polishes the semiconductor wafer is provided with a polishing device main body having a rotatable pedestal and an abrasive slurry tank which stores abrasive slurry containing a chelate agent and supplied onto the pedestal through an abrasive slurry supplying device. The abrasive slurry supplying device is provided with a device which removes heavy metal chelate anions contained in the abrasive slurry and a chelate agent supplying device after the removing device.

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