| 发明名称 |
Underfill compositions and methods for use thereof |
| 摘要 |
The invention is based on the discovery that certain polyester-linked compounds are useful as components in underfill compositions for the microelectonic packaging industry.
|
| 申请公布号 |
US2006069232(A1) |
申请公布日期 |
2006.03.30 |
| 申请号 |
US20050207987 |
申请日期 |
2005.08.19 |
| 申请人 |
|
发明人 |
DERSHEM STEPHEN M.;FORRAY DEBBIE |
| 分类号 |
C08G63/02 |
主分类号 |
C08G63/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
