A lead frame (201) for a packaged electronic device having split flag structures (205, 207) coupled by support structures (219). The support structures include bend portions (233) for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device (301). In one embodiment, the packaged electronic device includes an inertial sensor (515).
申请公布号
WO2005034177(A3)
申请公布日期
2006.03.30
申请号
WO2004US27934
申请日期
2004.08.27
申请人
FREESCALE SEMICONDUCTOR, INC.;LI, GARY, G.;CHAPMAN, MICHAEL, E., S.;MAHADEVAN, DAVE, S.
发明人
LI, GARY, G.;CHAPMAN, MICHAEL, E., S.;MAHADEVAN, DAVE, S.