| 发明名称 |
METHOD FOR OBTAINING A THIN LAYER BY IMPLEMENTING CO-IMPLANTATION AND SUBSEQUENT IMPLANTATION |
| 摘要 |
<p>The invention proposes a method for transferring a thin layer of semiconductor material on a substrate by the SMARTCUT<sup</p> |
| 申请公布号 |
WO2006032948(A1) |
申请公布日期 |
2006.03.30 |
| 申请号 |
WO2004IB03301 |
申请日期 |
2004.09.21 |
| 申请人 |
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES;AKATSU, TAKESHI |
发明人 |
AKATSU, TAKESHI |
| 分类号 |
(IPC1-7):H01L21/762 |
主分类号 |
(IPC1-7):H01L21/762 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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