发明名称 ELECTROLESS PALLADIUM-SILVER ALLOY PLATING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide an electroless palladium-silver alloy plating liquid with which a palladium-silver alloy film having excellent performance is formed. SOLUTION: The electroless palladium-silver alloy plating liquid is composed of an aqueous solution containing: (i) a water soluble palladium compound; (ii) a water soluble silver compound; (iii) at least one kind of component selected from the group consisting of ammonia, monomethylamine, monoethylamine, dimethylamine, diethylamine and monoethanolamine; (iv) an ethylenediamine expressed by the general formula (wherein, n is an integer of 1 to 5; R is a hydrogen atom or -CH<SB>2</SB>-CH<SB>2</SB>-NH<SB>2</SB>); (v) a water soluble aldehyde compound; and (vi) a water soluble compound including transition elements of the periodic fourth period in a periodic table. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006083446(A) 申请公布日期 2006.03.30
申请号 JP20040271047 申请日期 2004.09.17
申请人 OKUNO CHEM IND CO LTD 发明人 SHIMOJI TERUAKI;OKUMURA HAJIME;IWAMATSU KATSUSHIGE
分类号 C23C18/48 主分类号 C23C18/48
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