发明名称 |
Transponder has antenna wires on substrate with laterally offset connection to flip chip modules using contact surfaces on connection bridge substrate |
摘要 |
<p>A transponder has antenna wires (12) on a substrate with laterally offset connection (14a, b) to flip chip modules (13) using contact surfaces (11a, b) on a connection bridge substrate (10). Independent claims are included for manufacturing procedures used to make the transponders.</p> |
申请公布号 |
DE102004045896(A1) |
申请公布日期 |
2006.03.30 |
申请号 |
DE20041045896 |
申请日期 |
2004.09.22 |
申请人 |
MUEHLBAUER AG |
发明人 |
RIED, MICHAEL;SUES, JUERGEN;BRUNNER, ANTON |
分类号 |
H04B1/59;G06K7/00;G06K19/00;H05K1/18;H05K3/32 |
主分类号 |
H04B1/59 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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