| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which an optical functional element such as a line CCD is packaged, the semiconductor device being designed such that optical elements of different linear expansion coefficients, which are a lens disposed right in front of the package and a translucent substrate for the optical functional element, are fixed together without degrading their optical characteristics. SOLUTION: The translucent substrate 4, such as glass, and the lens 2 are stuck together with fixing members 3a and 3b. The fixing member 3a at the middle of the lens 2 is a member that has high hardness after hardened. The fixing members 3b outside the fixing member 3a are members that have low hardness after hardened. The fixing members 3a and 3b are disposed on the periphery of the optical path of the lens 2 and optical functional element 1, and out of the optical path. COPYRIGHT: (C)2006,JPO&NCIPI
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