发明名称 |
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same |
摘要 |
A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.
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申请公布号 |
US2006068579(A1) |
申请公布日期 |
2006.03.30 |
申请号 |
US20040954999 |
申请日期 |
2004.09.29 |
申请人 |
SUH DAEWOONG;JAYARAMAN SAIKUMAR;LEHMAN STEPHEN E JR;PATEL MITESH;BYRNE TIFFANY A;MARTIN EDWARD L;BASIRON MOHD ERWAN B;LOH WEI KEAT;LIM SHEAU HOOI;CHIN YOONG TATT P |
发明人 |
SUH DAEWOONG;JAYARAMAN SAIKUMAR;LEHMAN STEPHEN E.JR.;PATEL MITESH;BYRNE TIFFANY A.;MARTIN EDWARD L.;BASIRON MOHD ERWAN B.;LOH WEI KEAT;LIM SHEAU HOOI;CHIN YOONG TATT P. |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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主权项 |
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地址 |
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