| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali development type photosensitive resin composition having excellent developing property and heat resistance and suitable to be used for a solder resist ink developed with a diluted alkali aqueous solution. <P>SOLUTION: The alkali development type photosensitive resin composition contains a carboxylic group-containing photopolymerizable unsaturated compound (A), an epoxy resin (X) having a methyl group-substituted epoxy group, and a photopolymerization initiator (C). The invention provides a resist ink using the alkali development type photosensitive resin composition, and a printed wiring board having circuits formed by using the resist ink. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
