| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor laser equipment which can accurately process a chip in die bond, and exactly prevent incorrect recognition in wire bonding. SOLUTION: In semiconductor laser equipment 100, a chip 13 emitting laser beam is mounted in one side face of a polygon-shape lead frame 11 formed in outline by a plurality of straight side 15. The lead frame 11 comprises a mount reference 27 locating at a designated distance from a luminous point of the chip 13, which consists of at least one side of the outline; a dashing reference 35 consisting of at least one side 15c, among the outline, parallel to a virtual central line 31 passing the luminous point; and a recognizing mark 37 which is punched with a designated distance from an electrode in a region except chip 13 mounted area of the lead frame 11, and has a profile different from the electrode simultaneously. And, these mount reference 27, dashing reference 35, and recognizing mark 37 are formed simultaneously by a press forming of the lead frame 11. COPYRIGHT: (C)2006,JPO&NCIPI
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