| 摘要 |
PROBLEM TO BE SOLVED: To efficiently correct the warp of a printed-wiring board. SOLUTION: Mounted components 220 are mounted on the first surface of the printed-wiring board 200, and the first surface of the printed-wiring board 200 faced downward is supported by a supporting base 112 at the periphery of the printed-wiring board 200. From above a second surface of the printed-wiring board 200 on the opposite side of the first surface, the periphery of the printed-wiring board 200 is supported by a board fixing unit 113. A warp correcting plate 130 having a flat surface is placed on the region of the second surface which is obtained by removing the periphery of the second surface from the second surface, and a plurality of warp correcting pins 122 are pressed against the region of the first surface where the components 220 are not mounted, from under the first surface. COPYRIGHT: (C)2006,JPO&NCIPI
|
