| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for preventing an electric circuit of a substrate from shorting, due to the savings of plating produced, when a terminal is pressed in a through hole. SOLUTION: In the through hole processing method, a conic member 26 which has its axis aligned with the through hole 34 and also has its peak disposed to face the through hole 34 is pressed against the substrate 28, such that the through hole 34 for pressing a terminal in whose axis extends in a normal to surface direction of the substrate 28 and whose axis perpendicular section is circular is formed and a continuous plating layer 35 is formed in an inner peripheral area of the through hole 34 and in an opening circumference region of the through hole 34, and the plating layer 35 at an opening peripheral edge part of the through hole 34 is beveled into a dish shape. In the through hole processing method, the through hole is so processed that the value obtained by dividing the maximum diameter of the dish beveled part 36 by the minimum diameter of the dish beveled part is "1.04 to 2". COPYRIGHT: (C)2006,JPO&NCIPI
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