| 摘要 |
PROBLEM TO BE SOLVED: To improve stability in interlayer connection and copper foil peel strength of a surface layer in a high density substrate. SOLUTION: The method comprises a core lamination step for laminating a core substrate material and one or more core metal sheets; a core circuit formation step for making a core circuit forming substrate by forming a circuit by processing the metal sheet, a multilayering lamination step for laminating one or more multilayering metal sheets, one or more multilayering substrate materials, and one or more core circuit formation substrates; and a multilayering circuit formation step for forming a circuit by processing the multilayering metal sheet. In the constitution, the core circuit forming substrate comprises a reinforcement material made of a nonwoven fabric and a resin material, and the multilayering substrate material comprises a reinforcement material made of a nonwoven fabric and a resin material containing uncured resin. This makes it possible to stabilize the quality of interlayer connection and the like in the core circuit forming substrate. It is also possible to solve problems such as those related to mechanical strength including peel strength of a surface layer circuit, since multilayering lamination is performed by using the multilayering substrate material. COPYRIGHT: (C)2006,JPO&NCIPI |
