| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in heat resistance, moisture resistance, optical transparency and adhesiveness enough to be usable as an optical semiconductor sealing agent. SOLUTION: The epoxy resin composition comprises an epoxy resin(E) and a curing agent(C); wherein the epoxy resin(E) comprises 80-10 wt.% of an alicyclic epoxy compound of general formula(1)(wherein, R1-R32 are each H, OH or a 1-4C straight-chain or branched alkyl) and 20-90 wt.% of another epoxy compound [the components (A) and (B) come to a total of 100 wt.%]. COPYRIGHT: (C)2006,JPO&NCIPI
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